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PhD project: Minimal IC Sealing Methods for Small Implanted Devices
Supervisors: Prof. Andreas Demosthenous and Prof. Nick Donaldson
This project introduces a new hermetic packaging method for chip scale biomedical implantable devices, and to develop a thin film humidity sensor that can be used to verify the proposed sealing technique.
This packaging technique, which is based on wafer bonding technology, can be applied on the processed wafers containing sensitive electronics without introducing any degradation in electrical properties of the devices. As the implanted device needs to operate in human body, a harsh environment, for decades the humidity sensor will help to evaluate the hermeticity of the package and assure its long term and reliable operation.